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CES 2026 SK hynix unveils 16-high 48Gb HBM4
By Lee
Gyu-lee, The Korea Times - SK hynix will unveil its next-generation artificial
intelligence (AI) memory solutions at CES 2026 Tuesday, showcasing its latest
high-bandwidth memory (HBM) product, a 16-high 48-gigabyte HBM4, for the first
time in the world.
The
latest memory chip is a successor to the 12‑high 36-gigabyte HBM4 that
delivers a data rate of 11.7 gigabits per second. The chip development is on
track to meet consumer timelines.
Sixteen-high
HBM4 is widely viewed as a major technical achievement, as stacking 16 layers
dramatically increases manufacturing difficulty compared with 12-high products.
That is because 16-high chips require thinner spacing between DRAM dies,
tighter control of wafer warpage and much more precise alignment and
interconnect bonding. They also require more complex thermal management.
At its
CES 2026 booth, the company also displayed a graphics processing unit (GPU)
module equipped with 12-high 36-gigabyte HBM3E for Nvidia's latest AI server
units to demonstrate how the memory operates within a real AI environment. The
36-gigabyte 12-high HBM3E is SK hynix's flagship product currently leading the
global market.
“Under
the theme ‘Innovative AI, Sustainable Tomorrow,’ the company plans to showcase
a broad range of AI-optimized memory technologies,” the company said. “We will
closely engage with global customers to create new value together in the AI
era.”
Along
with HBMs, the company presented the small outline compression attached memory
module 2 (SOCAMM2), a low-power memory module optimized for AI servers, along
with a lineup of general-purpose memory products for AI workloads. The lineup
includes low-power double data rate 6 (LPDDR6), which is a significantly
improved version in data processing speed and power efficiency for on-device AI
applications.
SK
hynix also introduced a 2-terabit quadruple-level cell-based 321-layer NAND
product optimized for ultrahigh‑capacity solid‑state drives, a segment
seeing surging demand amid the expansion of AI data centers.
The
product offers one of the highest storage densities currently available and
delivers substantially improved performance and power efficiency over prior
generations, making it ideal for power-sensitive AI data center environments,
SK hynix said.
