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SK
hynix orders new equipment worth 44.2 bln won for next-gen HBM4
By Kang
Yoon-seung, Yonhap News Agency - SK hynix Inc. has ordered new high-bandwidth
memory (HBM) production equipment from Hanmi Semiconductor in a deal worth 44.2
billion won (US$28.7 million), a regulatory filing showed Monday, in a possible
bid to expand production of HBM4 products for U.S. chip giant Nvidia Corp.
Hanmi
Semiconductor said in a regulatory filing it has won the deal to supply
thermo-compression (TC) bonders to SK hynix through early September.
A TC
bonder, considered core equipment in HBM production, is used to stack multiple
dynamic random access memory (DRAM) chips to produce HBM.
With a
single TC bonder typically priced at around 3 billion won, industry watchers
said the agreement likely covers 15 units.
Hanmi
Semiconductor said it will supply the TC Bonder 4.5 Griffin, an upgraded
version of the TC Bonder 4.0 announced in May last year, which is presumed to
have been optimized for SK hynix's needs.
Industry
watchers said the equipment will be sent to the new M15X fab in Cheongju, about
110 kilometers south of Seoul.
SK
hynix, meanwhile, began mass production of HBM4 products in September last
year, which will be installed in Nvidia's Vera Rubin artificial intelligence
platform.
Earlier
in the day, SK Group Chairman Chey Tae-won said his company is making all-out
efforts to ensure a stable supply of chips to Nvidia.
"Most
of our cooperation so far has centered on memory, but from now on, we will
elevate our partnership to a higher level," Chey said.
Source: https://en.yna.co.kr/view/AEN20260608012500320?section=k-biz/index
